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Microsoft、第3世代AIチップ「Maia 300」を2027年に投入 GPU比で電力効率4割向上、自社サービスの主力推論基盤に
AI summary
Editorial policyMicrosoft announced its third-generation AI chip, Maia 300, featuring TSMC's 2nm process and HBM4, with plans for a 2027 launch as a core infrastructure for its services.
Key points
- •Designed specifically for inference, it improves power efficiency by 40% compared to GPU-based systems and achieves up to seven times the processing power of the previous generation.
- •It adopts TSMC's 2nm process technology and is configured with 288GB of HBM4 memory.
- •It will be deployed at a scale of several gigawatts and positioned as the primary inference infrastructure for Microsoft's own services.